Xin-Quan Lai: search on Z-Library

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1

dv/dt Noise canceling circuit in ultra-high-voltage MOS gate drivers

Zhao, Yong-Rui, Lai, Xin-Quan, Du, Han-Xiao, Liu, Cong

Journal:

Analog Integrated Circuits and Signal Processing

Year:

2013

Language:

english

File:

PDF, 812 KB

english, 2013

2

Efficient EMI reduction in multilayer PCB using novel wideband electromagnetic bandgap structures

Hui-Sen He, Xin-Quan Lai, Wen-Dan Xu, Jian-Guo Jiang, Ming-Xiang Zang, Qiang Ye, Qiang Wang

Journal:

International Journal of RF and Microwave Computer-Aided Engineering

Year:

2011

Language:

english

File:

PDF, 687 KB

english, 2011

3

Fast transient response high-accuracy current-sensing technique for step-up DC–DC converter

Du, Han-Xiao, Chi, Yuan, Lai, Xin-Quan

Journal:

Electronics Letters

Year:

2015

Language:

english

File:

PDF, 552 KB

english, 2015

4

Fixed-frequency adaptive on-time buck converter with ramp compensation

Li, Qin-Qin, Ye, Qiang, Lai, Xin-Quan, Yuan, Bing

Journal:

IET Power Electronics

Year:

2016

Language:

english

File:

PDF, 820 KB

english, 2016

5

Design of a hiccup mode over-current protection circuit for DC–DC switching converters

Ling-feng Shi, Xiang-yu Mao, Hui-sen He, Fu-bo Liu, Xin-quan Lai

Journal:

Microelectronics Journal

Year:

2012

Language:

english

File:

PDF, 1.39 MB

english, 2012

6

Design of adaptive dead-time control circuit for resonant half-bridge driver

Shi, Ling-Feng, Liu, Fu-Bo, He, Hui-Sen, Mao, Xiang-Yu, Lai, Xin-Quan

Journal:

International Journal of Electronics

Year:

2013

Language:

english

File:

PDF, 1.00 MB

english, 2013

7

ChemInform Abstract: Solid State Synthesis and Optical Limiting Effect of Two Heteroselenometallic Cubane-Like Clusters (μ3-MoSe4)M3 (PPh3)3Cl (M: Cu and Ag).

Qian-Feng Zhang, Yue-Nan Xiong, Tat-Shing Lai, Wei Ji, Xin-Quan Xin

Journal:

Year:

2000

Language:

english

File:

PDF, 36 KB

english, 2000

8

[IEEE 2013 IEEE 15th International Symposium and Exhibition on Advanced Packaging Materials (APM 2013) - Irvine, CA (2013.2.27-2013.3.1)] 2013 IEEE International Symposium on Advanced Packaging Materials - Study of signal integrity for a novel stacked cylindrical PoP package

Xin-Quan Lai,, Zhi-Qiang Xing,, Ling-Feng Shi,, Chen Liu,, Han-Xiao Du,

Year:

2013

Language:

english

File:

PDF, 1.50 MB

english, 2013

9

[IEEE 2013 IEEE 15th International Symposium and Exhibition on Advanced Packaging Materials (APM 2013) - Irvine, CA (2013.2.27-2013.3.1)] 2013 IEEE International Symposium on Advanced Packaging Materials - A novel type of stacked package and assembling method on the SOC

Ling-Feng Shi,, Hong-Feng Jiang,, Xin-Quan Lai,, Li-Ye Cheng,, Cong Liu,

Year:

2013

Language:

english

File:

PDF, 427 KB

english, 2013

10

[IEEE 2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings - Shanghai, China (2006.10.23-2006.10.26)] 2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings - An Improved Error Amplifier with Initial Voltage Reference

Dai, Guo-ding, Liu, Hong-yan, Lai, Xin-quan, Li, Bo

Year:

2006

Language:

english

File:

PDF, 104 KB

english, 2006

11

WIDEBAND SSN SUPPRESSION IN HIGH-SPEED PCB USING NOVEL PLANAR EBG

He, Hui-Sen, Lai, Xin-Quan, Ye, Qiang, Wang, Qiang, Xu, Wen-Dan, Jiang, Jian-Guo, Zang, Ming-Xiang

Journal:

Progress In Electromagnetics Research Letters

Year:

2010

File:

PDF, 491 KB

2010

12

[IEEE 2009 Fifth International Conference on Information Assurance and Security - Xi'An China (2009.08.18-2009.08.20)] 2009 Fifth International Conference on Information Assurance and Security - Paper Study of Embedded System Design Based on RFID Securities

Shi, Ling-feng, Lai, Xin-Quan, Guo, Bao-Long

Year:

2009

Language:

english

File:

PDF, 227 KB

english, 2009

13

Monolayer Multijunctions: Synthesis of In-Plane Artificial Lattices of Monolayer Multijunctions (Adv. Mater. 7/2018)

Chiu, Kuan-Chang, Huang, Kuan-Hua, Chen, Chun-An, Lai, Ying-Yu, Zhang, Xin-Quan, Lin, Erh-Chen, Chuang, Meng-Hsi, Wu, Jenn-Ming, Lee, Yi-Hsien

Journal:

Advanced Materials

Year:

2018

File:

PDF, 4.38 MB

2018

14

Line voltage compensation technology for AC-direct multiple-string LED drivers

Liu, Cong, Lai, Xin-quan, Du, Han-xiao

Journal:

IEICE Electronics Express

Year:

2015

Language:

english

File:

PDF, 1.34 MB

english, 2015

15

A Fast-Response RBAOT Controlled Buck Converter with Pseudo-Fixed Switching Frequency and Enhanced Output Accuracy

Yuan, Bing, Liu, Meng-Xue, Ng, Wai Tung, Lai, Xin-Quan

Journal:

IEEE Journal of Emerging and Selected Topics in Power Electronics

Year:

2019

Language:

english

File:

PDF, 3.99 MB

english, 2019

16

High-Efficient Hybrid Buck Converter With Switch-on-Demand Modulation and Switch Size Control for Wide-Load Low-Ripple Applications

Yuan, Bing, Lai, Xin-Quan, Wang, Hong-Yi, Shi, Ling-Feng

Journal:

IEEE Transactions on Microwave Theory and Techniques

Year:

2013

Language:

english

File:

PDF, 2.29 MB

english, 2013

17

DYNAMIC PULSE INTEGRATING CIRCUIT FOR INFRARED RECEIVERS

SHI, LING-FENG, ZENG, AI-QIN, LI, QIN-QIN, CHENG, LI-YE, LAI, XIN-QUAN

Journal:

Journal of Circuits System and Computers

Year:

2013

Language:

english

File:

PDF, 444 KB

english, 2013

18

Design and implement of LED drive circuit chip with the controllable constant output current

Xian-rui Li, Song-lin Wang, Xin-quan Lai, Yu-shan Li

Journal:

Optoelectronics Letters

Year:

2009

Language:

english

File:

PDF, 192 KB

english, 2009

19

Low quiescent current linear regulator using combination structure of bandgap and error amplifier

Liu, Cong, Chi, Yuan, Du, Han-Xiao, Lai, Xin-Quan

Journal:

Electronics Letters

Year:

2014

Language:

english

File:

PDF, 403 KB

english, 2014

20

[IEEE 2013 IEEE 15th International Symposium and Exhibition on Advanced Packaging Materials (APM 2013) - Irvine, CA (2013.2.27-2013.3.1)] 2013 IEEE International Symposium on Advanced Packaging Materials - A novel PoP model with thermal reliability

Xin-Quan Lai,, Da-Li Zhou,, Ling-Feng Shi,, Han-Xiao Du,, Hui-Sen He,

Year:

2013

Language:

english

File:

PDF, 877 KB

english, 2013

21

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Study of 3-D staking assembly based on the package material of PCB

Lu, Yu-zhong, Jiang, Jian-guo, Lai, Xin-quan, Wang, Xiu, Huang, Zhan-wu

Year:

2012

Language:

english

File:

PDF, 733 KB

english, 2012

22

[IEEE 2013 IEEE 15th International Symposium and Exhibition on Advanced Packaging Materials (APM 2013) - Irvine, CA (2013.2.27-2013.3.1)] 2013 IEEE International Symposium on Advanced Packaging Materials - A novel stacking method of filling hole used in package on package

Ling-Feng Shi,, Zheng Wei,, Xin-Quan Lai,, Qin-Qin Li,, Chen Liu,

Year:

2013

Language:

english

File:

PDF, 603 KB

english, 2013

23

Sectional linear LED driver for optimised efficiency in lighting applications

Lai, Xin-Quan, He, Hui-Sen, Liu, Cong, Du, Han-Xiao

Journal:

IET Power Electronics

Year:

2016

Language:

english

File:

PDF, 956 KB

english, 2016

24

A Stable Mode-Selectable Oscillator with Variable Duty Cycle and High-Efficiency

Cheng, Li-Ye, Lai, Xin-Quan

Journal:

Journal of Circuits System and Computers

Year:

2015

Language:

english

File:

PDF, 4.41 MB

english, 2015

25

Synthesis of In-Plane Artificial Lattices of Monolayer Multijunctions

Chiu, Kuan-Chang, Huang, Kuan-Hua, Chen, Chun-An, Lai, Ying-Yu, Zhang, Xin-Quan, Lin, Erh-Chen, Chuang, Meng-Hsi, Wu, Jenn-Ming, Lee, Yi-Hsien

Journal:

Advanced Materials

Year:

2017

Language:

english

File:

PDF, 2.34 MB

english, 2017

26

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - A novel type of stacked cylindrical PoP package

Cheng, Li-ye, Shi, Ling-feng, Cai, Cheng-shan, Meng, Chen, Lai, Xin-quan

Year:

2012

Language:

english

File:

PDF, 1.18 MB

english, 2012

27

A NOVEL CRM PFC CONTROL METHOD FOR REDUCING INDUCTOR

SHI, LING-FENG, GUAN, HUI-LI, LI, QIN-QIN, LAI, XIN-QUAN

Journal:

Journal of Circuits System and Computers

Year:

2014

Language:

english

File:

PDF, 778 KB

english, 2014

28

Influence and mitigation of long differential via stub on signal integrity

Chu, Xiu-Qin, Lu, Jian-Min, Wang, Jun, Li, Yu-Shan, Lai, Xin-Quan, Liu, Yang

Journal:

Electronics Letters

Year:

2015

Language:

english

File:

PDF, 504 KB

english, 2015

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